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Principal Engineer - Mechanical

Astronautics/Kearfott Corporation

Principal Engineer - Mechanical

Little Falls, NJ +1 location
Full Time
Paid
  • Responsibilities

    Kearfott Corporation, a global avionics, motion control and navigation supplier for over 100 years, is a leader in the design and manufacture of precision motion control products and inertial control components.  Our inertial guidance and navigation systems control military and commercial aircraft, military land vehicles, missiles, marine vehicles, satellites, and space instruments.

     

    We are looking for talented individuals who want to be part of a world class work force.  Join Kearfott and become part of a company that is recognized for technical expertise and respected world-wide as a ‘full service’ provider.  For more information visit our website at www.kearfott.com

     

    PRINCIPAL ENGINEER - MECHANICAL

     

    • Candidate will be a key member of the design engineering team responsible for various aspects of mechanical design, electronics packaging and general systems engineering.
    • Design work includes conceptual and detail design of machine components and assemblies, printed wiring boards and circuit card assemblies.  Analysis work includes thermal, stress and vibration.
    • Concurrent engineering work environment where members of the mechanical, electrical, test and system engineering groups collaborate on design and development projects, as well as provide support to sustain production.
    • Work environment is SolidWorks 2016-2018, SW PDM, Altium, Mentor, ANSYS, Matlab and LabVIEW.
    • Candidate needs to have working knowledge of US standards and specifications for materials and processes currently used in the aerospace – defense industry.
    • Familiarity with the US Aerospace-Defense industry including participation to major air-land-sea development programs is a plus.
    • This is a senior level technical position, responsible for developing concepts, packaging and solutions to complex issues, performing trade studies, and overseeing development activities through integration into production.

     

    Required Skills

    • Experience with SolidWorks 2016-2018 MCAD software for 3D models and 2D drawings
    • Experience with ALTIUM or MENTOR ECAD suite ( PADS / CAM350) for pwb design
    • Electronics packaging design experience
    • Familiar with both Military and Industry design standards. MIL-STD-810, DO160 and SAE, ASM, AISI, ASTM, IPC, MIL/DTL
    • Experience with designing machine parts and mechanical assemblies
    • Experience with mfg. processes
    • Experience with thermal, vibration and stress analysis (ANSYS modeling preferred)

     

    CRITICAL COMPETENCIES

    • Strong mechanical design and electronics packaging experience
    • Strong Engineering Analysis
    • Excellent oral and written communication skills
    • Drives for results, action-oriented
    • Team/group/project leadership experience

    Required Experience

    • 10+ years in Mechanical and Electronic Packaging design and development
    • Experience with defense / aerospace hardware
    • Printed wiring board / circuit card assembly experience
    • B.S. in Mechanical Engineering, M.S. preferred
    • Must be legally authorized to work in the U.S., visa sponsorship not available
    • Available to travel for customer and/or internal reviews and meetings (up to 15%)
    • Must be able to work on U.S. government programs and/or obtain security clearance in the future

     

    Equal Opportunity Employer

    Minorities/Females/Veterans/Individuals with Disabilities/Sexual Orientation/Gender Identity

  • Qualifications
    • Experience with SolidWorks 2016-2018 MCAD software for 3D models and 2D drawings
    • Experience with ALTIUM or MENTOR ECAD suite ( PADS / CAM350) for pwb design
    • Electronics packaging design experience
    • Familiar with both Military and Industry design standards. MIL-STD-810, DO160 and SAE, ASM, AISI, ASTM, IPC, MIL/DTL
    • Experience with designing machine parts and mechanical assemblies
    • Experience with mfg. processes
    • Experience with thermal, vibration and stress analysis (ANSYS modeling preferred)

     

    CRITICAL COMPETENCIES

    • Strong mechanical design and electronics packaging experience
    • Strong Engineering Analysis
    • Excellent oral and written communication skills
    • Drives for results, action-oriented
    • Team/group/project leadership experience
  • Industry
    Manufacturing
  • Locations
    Little Falls, NJ • Woodland Park, NJ