Type:
Full Time or Part Time:
Pay Rate:
Location:
Language Requirements:
- Speak, write, and read English at a professional level
Language Preferences:
Job Overview:
We are seeking a hardworking and passionate Assembly and Packaging Engineer to lead the development and improvement of advanced assembly processes for various applications, including Fan-Out Wafer Level Packaging (FOWLP) and interposers. Responsibilities will include collaborating effectively with foundry customers and colleagues and overseeing process development in areas such as wafer back-end manufacturing, die singulation, wire bonding, and final PCB laminate assembly. A strong technical background in semiconductor device packaging, along with knowledge of high-density interconnect technologies, is preferred. Excellent oral and written communication skills are essential for effectively conveying ideas and solutions within a dynamic environment. Other duties as assigned. Percentages of time spent on job duties are estimates and may vary.
Experience Requirements:
- Must be subject to the International Traffic in Arms Regulations (ITAR). All accepted applications must be U.S. Persons as defined by ITAR. ITAR defines a U.S. Person as a U.S. citizen, U.S. Permanent Resident, Political Asylee, or Refugee.
- A minimum of 5 years of experience in semiconductor packaging engineering, with a comprehensive understanding of advanced packaging technologies such as 2.5D, 3D IC, Flip Chip, WLCSP, and Fan-Out.
- A minimum of three (3) years of supervisory experience in a health or social services program, with experience directing a senior care program
- Experience working in a manufacturing and/or cleanroom environment.
- Experience working and developing processes on manufacturing equipment.
- Experience with project management tools, such as Gantt charts, to plan and communicate project and development status.
- Knowledge of reliability test methods and qualification procedures.
- Experience with wire bonding, hermetic sealing, automatic pick and place, flip chip assembly and solder reflow.
- Proficiency in material and package characterization data analysis, and statistical data analysis.
- Proficient in DOE and SPC. Knowledge of 6-sigma concepts and applications.
- Can work both independently and in (or lead) cross-functional teams for problem-solving.
- Desire to work in a fast-paced, challenging, and risk-taking environment.
Experience Preferences:
- 10 years of relevant experience
Physical Requirements:
- The position may involve working at equipment or assembly stations for long periods.
- Occasionally lifting and moving equipment or materials may require some physical strength.
- Performing tasks that require fine motor skills, such as handling small components or operating machinery.
- Close visual acuity may be necessary for tasks such as inspecting components or aligning parts.
Education Requirements:
- BS Engineering, MS/PhD preferred. Physics, Electrical Engineering, Materials Science or equivalent.
Education Preferences:
Training Schedule:
Schedule:
Dress Code:
Benefits:
- Competitive salary along with financial benefits
- Bonuses
- Life insurance
- 401k match
- Opportunities to purchase company stock at a discounted rate
- A comprehensive benefits package is provided to promote a healthy lifestyle, featuring benefit eligibility from day one, paid time off, paid holidays, access to an on-site fitness facility, an on-site self-serve market, and much more.
Additional Information:
Drug screening, background and reference checks are performed if required. Valid identification and reliable transportation required. We are an E-Verify employer. We will provide the Social Security Administration (SSA) and, if necessary, the Department of Homeland Security (DHS), with information from each new employee’s Form I-9 to confirm work authorization. Our employees are authorized to work in the United States.