Type:

• Direct Hire

Full Time or Part Time:

• Full-Time

Pay Rate:

• TBD

Location:

• Kissimmee, FL 34744

Language Requirements:

• Write, read, and speak English fluently.

Language Preferences:

• N/A

Job Overview:

We are looking for a hardworking and passionate Assembly and Packaging Engineer for our Florida Advanced Packaging site. In this role you will lead, develop and improve advanced assembly processes for multiple application areas, including Fan-Out Wafer Level Packaging (FOWLP), interposers and other technology platforms. Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with customers, colleagues, and management.

You should have experience with process development and processing equipment in most of these areas: wafer back-end manufacturing processes, die singulation, pick & place and sorting, wire bonding, precision flip chip die bonding, underfills, encapsulation molding, micro-dispensing, optical alignment and final printed circuit board laminate assembly. Strong technical background in semiconductor device packaging with knowledge of high-density interconnect technologies, flip-chip surface mount assembly utilizing high density microbumps and fan-out-wafer-level-packaging (FOWLP) is highly preferred.

Your responsibilities will include: Develop processes and act as subject matter expert for die attach, epoxy molding and precision high density flip chip; Developing new advanced packaging methods for next generation products in fan-out-wafer-level-packaging (FOWLP); Utilize program management methodology to plan, execute and monitor complex process and/or product development projects; Facilitate or lead cross-functional technical teams through New Product Introduction (NPI) and process improvement; Design for manufacturability and cost to ensure smooth transition to High Volume Manufacturing; Develop and deploy advanced design rules into next generation products; Determining root causes of failures using statistical methods and recommend changes in designs, tolerances, or processing methods; Utilize Lean Manufacturing techniques to reduce manufacturing costs and improve manufacturing yield; Investigate or resolve operational problems, such as material use variances or bottlenecks; Preparing and maintaining documentation for manufacturing processes and engineering procedures; Incorporating automation into manufacturing processes; Reviewing product designs for manufacturability or completeness. The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position. 

If selected, you will be working in an exciting environment where the brightest semiconductor minds come together to achieve exceptional results.

Experience Requirements:

• Minimum of 5 years (10 years preferred) of experience in semiconductor packaging engineering, with a comprehensive understanding of advanced packaging technologies such as 2.5D, 3D IC, Flip Chip, WLCSP, and Fan-Out.

• Experience working in a manufacturing and/or cleanroom environment.

• Experience working and developing processes on manufacturing equipment.

• Experience with project management tools, such as Gantt charts, to plan and communicate project and development status.

• Knowledge of reliability test methods and qualification procedures.

• Experience with wire bonding, hermetic sealing, automatic pick and place, flip chip assembly and solder reflow.

• Proficiency in material and package characterization data analysis, and statistical data analysis.

• Proficient in DOE and SPC. Knowledge of 6-sigma concepts and applications.

• Can work both independently and in (or lead) cross-functional teams for problem solving.

• Desire to work in a fast-paced, challenging, and risk-taking environment.

• Desire to be part of a team that will transform the electronics industry in the United States.

• US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.

Experience Preferences:

• N/A

Physical Requirements:

• Ability to lift light equipment or materials, generally up to 20-30 pounds.

• Adequate vision to perform tasks effectively, including close and distance work.

• Good hearing ability to effectively communicate and respond to auditory cues.

• Capacity to perform repetitive tasks consistently with minimal breaks, demonstrating endurance and stamina throughout the work shift.

• You will be based in Kissimmee, Florida but open to travel abroad for technical discussions, training and brainstorming.

Education Requirements:

• BS Engineering, Physics, Electrical Engineering, Materials Science or equivalent.

Education Preferences:

• MS/PhD preferred.

Training Schedule:

• TBD

Schedule:

• TBD

Dress Code:

• Business Casual

Benefits:

• We offer competitive salary and financial benefits, such as bonuses, life insurance, 401k match, and opportunities to buy company stock at a discounted rate. We provide benefits that promote a healthy life, such as, comprehensive benefits package including benefit eligibility day one, paid time off, paid holidays, an on-site fitness facility, an on-site, self-serve market and so much more!

Additional Information:

Drug screening, background and reference checks are performed if required. Valid identification and reliable transportation required. We are an E-Verify employer. We will provide the Social Security Administration (SSA) and, if necessary, the Department of Homeland Security (DHS), with information from each new employee’s Form I-9 to confirm work authorization. Our employees are authorized to work in the United States.