Job Description

DESCRIPTION:

Packaging Application Engineering Manager is to provide current and potential customers with technical support regarding products, applications, and issues, servicing and qualifying both new product introductions and existing Showa Denko’s advanced packaging materials through deep experience and knowledge in semiconductor assembly and process materials. Candidate requires excellent critical thinking, communication and interpersonal skills. 

PRIMARY JOB FUNCTIONS:

1.       Provide comprehensive technical and quality support for new and existing customers in the packaging materials i.e. epoxy molding compound, die bonding materials, thermal interface materials, and various other materials both commercial and developmental grades. This will include but not limited to:

·       Promote or introduce new product leading to qualification on current or future customer products

·       On-site technical support on need-to basis

·       Respond to customer’s quality issues

·       Problem solving with collaboration with corporate R&D

·       Build and maintain excellent relationship with customers to advance opportunities for new business potential

Above will be executed in conjunction with a sales representative.

2.       Closely gather and analyze market/industry trends and technology roadmaps and feed relevant information to corporate R&D.

3.       Working with corporate R&D and marketing team, devise R&D strategies that will enable growth of company’s global packaging materials business.

4.       Build and sustain network with key industry personnel (IDM’s, foundries, equipment vendors, OSATs, etc.)

5.       Attend technical conferences and trade shows to present technical papers to promote company’s products and services.

6.       Assess technologies of other companies (start-ups, competitors, and partners) and make recommendations when it is a good fit for SDM’s technology portfolio.

7.       Provide technical support to venture new applications or new product development opportunities with both customers and HQ R&D.

EXPERIENCE:

10+ years of experience working within semiconductor packaging/assembly industry experience are required.

Must have a deep technical knowledge of advanced packaging technologies such as in surface mount technology and leading-edge trends in wafer level packaging and convergence of wafer processing and assembly.

Demonstrate an understanding of the interface between materials and the packages.

Active role or participation in technical association, standards or related trade conferences is a plus.

TRAVEL: The position requires 30-40% travel.

Company Description

Formed in 1939, Showa Denko K.K. (SDK) manufactures chemical products and industrial materials. SDK’s products serve a wide array of fields ranging from heavy industry to the electronic and computer industries. The company is divided in five business sectors: petrochemicals, aluminum, electronics, chemicals, and inorganic materials. Showa Denko has more than 180 subsidiaries and affiliates around the world.